TLE5012BD E1200

TLE5012BD GMR-Based Angle Sensor 1 Overview Features • Giant Magneto Resistance (GMR)-based principle • Fully redundant design with two sensor ICs in one package • Integrated magnetic field sensing for angle measurement • 360° angle measurement with revolution counter and angle speed measurement • Two separate highly accurate single bit SD-ADC • 15 bit representation of absolute angle value on the output (resolution of 0.01°) • 16 bit representation of sine / cosine values on the interface • Max. 1.0° angle error over lifetime and temperature-range with activated auto-calibration • Bi-directional SSC Interface up to 8 Mbit/s • Supports Safety Integrity Level (SIL) with diagnostic functions and status information • Interfaces: SSC, PWM, Incremental Interface (IIF), Hall Switch Mode (HSM), Short PWM Code (SPC, based on SENT protocol defined in SAE J2716) • Output pins can be configured (programmed or pre-configured) as push-pull or open-drain • Bus mode operation of multiple sensors on one line is possible with SSC or SPC interface • 0.25 µm CMOS technology • Automotive qualified: -40°C to 150°C (junction temperature) • ESD > 4 kV (HBM) • RoHS compliant (Pb-free package) • Halogen-free PRO-SIL™ Features • Test vectors switchable to ADC input (activated via SSC interface) • Inversion or combination of filter input streams (activated via SSC interface) • Data transmission check via 8-bit Cyclic Redundancy Check (CRC) for SSC communication and 4-bit CRC nibble for SPC interface • Built-in Self-test (BIST) routines for ISM, CORDIC, CCU, ADCs run at startup • Two independent active interfaces possible • Overvoltage and undervoltage detection Data Sheet www.infineon.com 1 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Overview Potential applications The TLE5012BD GMR-based angle sensor is designed for angular position sensing in automotive applications such as: • Electrical commutated motor (e.g. used in Electric Power Steering (EPS)) • Steering angle measurements • General angular sensing Product validation Qualified for automotive applications. Product validation according to AEC-Q100. About this document This document is an addendum to the TLE5012B datasheet and describes the TLE5012BD dual die angle sensor. For all parameters which are not specified here, the TLE5012B datasheet is valid. Description The TLE5012BD is a 360° angle sensor that detects the orientation of a magnetic field. This is achieved by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance (iGMR) elements. These raw signals (sine and cosine) are digitally processed internally to calculate the angle orientation of the magnetic field (magnet). The TLE5012BD is a pre-calibrated sensor. The calibration parameters are stored in laser fuses. At start-up the values of the fuses are written into flip-flops, where these values can be changed by the application-specific parameters. Further precision of the angle measurement over a wide temperature range and a long lifetime can be improved by enabling an optional internal autocalibration algorithm. Data communications are accomplished with a bi-directional Synchronous Serial Communication (SSC) that is SPI-compatible. The sensor configuration is stored in registers, which are accessible by the SSC interface. Additionally four other interfaces are available with the TLE5012BD: Pulse-Width-Modulation (PWM) Protocol, Short-PWM-Code (SPC) Protocol, Hall Switch Mode (HSM) and Incremental Interface (IIF). These interfaces can be used in parallel with SSC or alone. Pre-configured sensor derivates with different interface settings are available. Table 1 Derivate ordering codes Product type Marking Ordering code Package TLE5012BD E1200 121200 SP001205296 PG-TDSO-16 TLE5012BD E9200 129200 SP001205300 PG-TDSO-16 Data Sheet 2 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 2.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Dual Die Angle Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 4.1 4.2 4.2.1 4.3 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input/Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calculation of the Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5.1 5.2 Pre-Configured Derivates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 IIF-type: E1200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 SPC-type: E9200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 6.1 6.2 6.3 6.4 6.5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Data Sheet 3 6 6 6 6 7 10 10 10 13 13 13 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Pin Configuration 2 Pin Configuration 16 15 14 13 12 11 10 9 Center of Sensitive Area 1 2 3 4 Figure 1 Pin configuration (top view) 2.1 Pin Description Table 2 Pin Description 5 6 7 8 Pin No. Symbol In/Out Function 1 IFC1 (CLK / IIF_IDX / HS3) I/O Die 1 Interface C: External Clock1) / IIF Index / Hall Switch Signal 3 2 SCK1 I Die 1 SSC Clock 3 CSQ1 I Die 1 SSC Chip Select 4 DATA1 I/O Die 1 SSC Data 5 DATA2 I/O Die 2 SSC Data 6 CSQ2 I Die 2 SSC Chip Select 7 SCK2 I Die 2 SSC Clock 8 IFC2 (CLK / IIF_IDX / HS3) I/O Die 2 Interface C: External Clock1) / IIF Index / Hall Switch Signal 3 9 IFB2 (IIF_B / HS2) O Die 2 Interface B: IIF Phase B / Hall Switch Signal 2 10 GND2 - Die 2 Ground 11 VDD2 - Die 2 Supply Voltage Data Sheet 4 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Dual Die Angle Output Table 2 Pin Description (cont’d) Pin No. Symbol In/Out Function 12 IFA2 O (IIF_A / HS1 / PWM / SPC) Die 2 Interface A: IIF Phase A / Hall Switch Signal 1 / PWM / SPC output 13 IFA1 O (IIF_A / HS1 / PWM / SPC) Die 1 Interface A: IIF Phase A / Hall Switch Signal 1 / PWM / SPC output 14 VDD1 - Die 1 Supply Voltage 15 GND1 - Die 1 Ground 16 IFB1 (IIF_B / HS2) O Die 1 Interface B: IIF Phase B / Hall Switch Signal 2 1) External clock feature is not available in IIF or HSM interface mode 3 Dual Die Angle Output The bottom sensor element of the TLE5012BD is flipped relative to the orientation of the top sensor element Therefore the rotation direction sensed by the bottom element is opposite to the top element. This is advantageous for safety critical applications, as the two sensor elements do generally not output the same angle. Figure 2 shows the output of the two sensor ICs for a given external magnetic field orientation. 360° top sensor output bottom sensor output sensor output angle 270 ° 180 ° 90° 0° Figure 2 90° 180° 270° external magnetic field angle 360 ° Dual die angle output For applications where an identical angle output of both ICs is desired, the rotation direction and angle offset of one sensor IC can be reconfigured by changing the settings in the ANG_BASE and ANG_DIR registers via SSC interface. Data Sheet 5 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Specification 4 Specification 4.1 Absolute Maximum Ratings Table 3 Absolute maximum ratings Parameter Symbol Values Min. Unit Note or Test Condition Typ. Max. Ambient temperature TA -40 125 °C Junction temperature TJ -40 150 °C 150 °C qualification acc. to AEC Q100 grade 1 For 1000 h, not additive Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. Table 4 ESD protection Parameter Symbol Min. ESD voltage Unit Values Notes Max. VHBM ±4.0 kV 1) VHBM ±2.0 kV 1) VCDM ±0.5 kV 2) VCDM ±0.75 kV 2) ground pins connected for corner pins 1) Human Body Model (HBM) according to ANSI/ESDA/JEDEC JS-001 2) Charged Device Model (CDM) according to JESD22-C101 4.2 Characteristics 4.2.1 Input/Output characteristics The indicated parameters apply to the full operating range, unless otherwise specified. The typical values correspond to a supply voltage VDD = 5.0 V and 25°C, unless individually specified. All other values correspond to -40 °C < TJ < 150°C. Table 5 Electrical parameters for 4.5 V < VDD < 5.5 V Parameter Symbol Values Min. Input signal low-level VL5 Input signal high level VH5 Data Sheet Typ. Unit Note or Test Condition Max. 0.3 VDD 0.7 VDD V V 6 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Specification Table 5 Electrical parameters for 4.5 V < VDD < 5.5 V (cont’d) Parameter Symbol Values Unit Note or Test Condition 1 V DATA; IQ = -25 mA (PAD_DRV=’0x’), IQ = -5 mA (PAD_DRV=’10’), IQ = -0.4 mA (PAD_DRV=’11’) 1 V IFA,B,C; IQ = -15 mA (PAD_DRV=’0x’), IQ = -5 mA (PAD_DRV=’1x’) -10 -225 µA CSQ -10 -150 µA DATA 10 225 µA SCK 10 150 µA IFA, IFB, IFC Min. Typ. Output signal low-level VOL5 Pull-up current1) IPU 2) Pull-down current IPD Max. 1) Internal pull-ups on CSQ and DATA pin are always enabled. 2) Internal pull-downs on IFA, IFB and IFC are enabled during startup and in open-drain mode, internal pull-down on SCK is always enabled. Table 6 Electrical parameters for 3.0 V < VDD < 3.6 V Parameter Symbol Values Min. Input signal low-level VL3 Input signal high level VH3 Output signal low-level VOL3 Pull-up current1) IPU 2) Pull-down current IPD Typ. Unit Note or Test Condition Max. 0.3 VDD 0.7 VDD 0.8 VDD V V V DATA,SCK,CSQ,IFA,IFB IFC 0.9 V DATA; IQ = -15 mA (PAD_DRV=’0x’), IQ = -3 mA (PAD_DRV=’10’), IQ = -0.24 mA (PAD_DRV=’11’) 0.9 V IFA,IFB; IQ = - 10 mA (PAD_DRV=’0x’), IQ = -3 mA (PAD_DRV=’1x’) -3 -225 µA CSQ -3 -150 µA DATA 3 225 µA SCK 3 150 µA IFA, IFB, IFC 1) Internal pull-ups on CSQ and DATA pin are always enabled. 2) Internal pull-downs on IFA, IFB and IFC are enabled during startup and in open-drain mode, internal pull-down on SCK is always enabled. 4.3 Calculation of the Junction Temperature The total power dissipation PTOT of the chips leads to self-heating, which increases the junction temperature TJ above the ambient temperature. Data Sheet 7 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Specification The power multiplied by the total thermal resistance RthJA (junction to ambient) yields the junction temperature. RthJA is the sum of the two components Junction to Case and Case to Ambient. (4.1) R thJA = R thJC + R thCA TJ = T A + Δ T Δ T = R thJA × PTOT = R thJA × (V DD × 2 I DD +  VQ × 2 I Q ) (IDD, IQ > 0, if direction is into IC) Q Factors of 2 in the calculation account for the two sensor ICs in the TLE5012BD. Example (assuming no load on Vout). (4.2) V DD = 5V 2 I DD = 28 mA K  Δ T = 120   × (5 [V ]× 0 . 028 [ A ] + 0 [VA ]) = 16 . 8 K W  For molded sensors, the calculation with RthJC is more appropriate. Data Sheet 8 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Pre-Configured Derivates 5 Pre-Configured Derivates Derivates of the TLE5012BD are available with different pre-configured register settings for specific applications. The configuration of all derivates can be changed via SSC interface. A detailed table of settings of the derivates can be found in the latest TLE5012B Register Setting User Manual. 5.1 IIF-type: E1200 The TLE5012BD-E1200 is preconfigured for Incremental Interface and fast angle update rate (42.7 μs). It is most suitable for BLDC motor commutation. • Autocalibration mode 1 enabled. • Prediction disabled. • Hysteresis is set to 0.625°. • 12bit mode, one count per 0.088° angle step. • Incremental Interface A/B mode. 5.2 SPC-type: E9200 The TLE5012BD-E9200 is preconfigured for Short-PWM-Code interface. It is most suitable for steering angle and actuator position sensing. • Angle update time is 85.4 μs. • Autocalibration, Prediction, and Hysteresis are disabled. • SPC unit time is 3 μs. • SPC interface is set to open-drain output. Data Sheet 9 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Package Information 6 Package Information 6.1 Package Parameters Table 7 Package Parameters Parameter Symbol Limit Values Unit Notes Min. Typ Max. . Thermal resistance1) 140 K/W Junction to air2) RthJC 35 K/W Junction to case RthJL 70 K/W Junction to lead RthJA 120 Moisture Sensitivity Level MSL 3 Lead Frame 260°C Cu Plating Sn 100% > 7 μm 1) Rth values only valid for both dies supplied with VDD 2) according to Jedec JESD51-7 6.2 Package Outline Figure 3 PG-TDSO-16 package dimension Data Sheet 10 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Package Information 0.2 0.2 Figure 4 Data Sheet Position of sensing element, reference to package 11 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Package Information Figure 5 Position of sensing element, reference to lead frame Table 8 Sensor IC placement tolerances in package Parameter Unit Values Min. Notes Max. position eccentricity -100 100 µm in X- and Y-direction, reference to package position eccentricity -150 150 µm in X-direction, reference to lead frame position eccentricity -200 200 µm in Y-direction, reference to lead frame rotation -3 3 ° tilt -3 3 ° Data Sheet 12 affects zero position offset of sensor Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Package Information 6.3 Footprint Figure 6 Footprint of PG-TDSO-16 6.4 Packing Figure 7 Tape and Reel 6.5 Marking The device is marked on the frontside with a date code, the device type and a lot code. On the backside is a 8 x 18 data matrix code. Position Marking Description 1st Line Gxxxx G = green, 4-digit = date code 2nd Line 12x200 Type (6 digits), See ordering Table 1 3rd Line xxx Lot code (3 digits) Note: Data Sheet For processing recommendations, please refer to Infineon’s Notes on processing 13 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Package Information Figure 8 Data Sheet Marking 14 Rev. 1.3 2019-02-05 TLE5012BD GMR-Based Angle Sensor Revision history 7 Revision history Revision Date Changes Rev. 1.3 New Template/New Logo Update Electrical parameters: VH3 for IFC pin Data Sheet 2019-02-05 15 Rev. 1.3 2019-02-05 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2019-02-05 Published by Infineon Technologies AG 81726 Munich, Germany © 2019 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? 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